Polyurethane electronic adhesive
High bonding strength: Providing exceptional adhesion even under heat and stress — ideal for electronic assemblies.
High gas barrier: The aromatic ring structure of FDCA enhances oxygen and moisture barrier properties, protecting sensitive circuits from environmental degradation.
High bio-based ratio: Developed using bio-based FDCA, the formulation enables a high content of renewable components, aligning electronic materials with global ESG targets.